Guangdong shengyi sci. tech co. ltd

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Other Databases. After continuous effort, Shengyi becomes not only the leader in Chinese copper clad laminate industry, but also the most competitive professional Dongguan indigenous manufactory in international market. Based in Dongguan sinceShengyi Technology Co. Date of Patent: January 29, Filed: March 18, Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. Inventor: Ming-She Su. The epoxy resin compound comprises: parts by weight of epoxy resin; parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof beingwhich is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; parts by weight of filler; parts by weight of ingredient. Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom.

  • SHENGYI TECHNOLOGY CO.,LTDVG Technologies co.,ltd (SH Group Subsidiary)
  • SHENGYI TECHNOLOGY (SS) Stock Price, Quote, History & News
  • Guangdong Shengyi Co. Ltd.
  • GUANGDONG SHENGYI SCI. TECH CO., LTD ()
  • Shengyi Technology Co., Ltd Company Profile EMIS

  • SHENGYI TECHNOLOGY CO.,LTDVG Technologies co.,ltd (SH Group Subsidiary)

    Guangdong Shengyi Sci. Tech Co., Ltd. is principally engaged in the manufacture and distribution of copper clad laminates (CCLs).

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    The Company provides. Guangdong Shengyi Co. Ltd. Manufacturer of FR-4, CEM-1, CEM-3 and Prepreg. Products are mainly used for making single side, double side and.

    SHENGYI TECHNOLOGY (SS) Stock Price, Quote, History & News

    Shengyi Technology Co., Ltd. (SYTECH), founded inis a global core supplier of electronic circuit base materials which integrates R&D, production, sales.
    The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Publication date: February 27, The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing.

    Date of Patent: November 11, Abstract: The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same.

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    Guangdong shengyi sci. tech co.

    images guangdong shengyi sci. tech co. ltd

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    Filed: September 3, Inventor: Xian-Ping Zeng. Publication date: February 13, Thermoset resin composition and its use.

    GUANGDONG SHENGYI SCI. TECH CO., LTD ()

    Other Databases. Publication date: October 10, The epoxy resin composition of the present invention can provide the prepreg and copper clad laminate made therefrom with high glass transition temperature, high heat resistance, low expansion coefficient and low moisture absorption, which can meet demands of high reliability of high density multi-layer PCBs.

    Shengyi Technology Co., Ltd.

    images guangdong shengyi sci. tech co. ltd

    (SYTECH) was founded in Junewith registered capital of billion RMB. SYTECH is a Sino-foreign listed joint venture. The company is the largest professional CCL manufacturer. The main products are flame-retardant epoxy glass fiber cloth CCL, compound epoxy CCL. Type: Grant. Filed: September 14, Date of Patent: January 29, Assignee: GUANGDONG SHENGYI SCI.

    TECH CO., LTD. Inventor: Minshe Su.
    Filed: November 7, The baseboard uses a porous ePTFE film with excellent dielectric as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard.

    Shengyi Technology Co., Ltd Company Profile EMIS

    The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance. Law Students.

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    The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: Wherein, n represents an integer between 1 and

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<p>tech co. ltd
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    The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Inventor: Ming-She Su. Tech Co. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature Tghigh thermal resistance, low dielectric dissipation factor, low moisture, and low C.

    Filed: September 3, Date of Patent: October 25,